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Preforms Solder Chips Mini Bars Solderforms SN63/PB37 Kester

Preforms Solder Chips Mini Bars Solderforms SN63/PB37 Kester

Manufacturer: Kester
Part Number: A2C5318034
Mounting: Surface Mount
Color: Silver
Shape: Rectangle
Termination Method: Solder

Price: $0.10
87400 available for immediate delivery
Code: HW007PD12
Weight: 0.01oz ONZ
Volume Pricing
Quantity Price Each
1-99$0.10
100-999$0.08
1000+$0.05
Quantity:

First Class Mail Shipping Costs:

Order Total Minimum
Order Total Maximum
USA First Class Shipping Rates
$00.01
$25.00
$5.85
$25.01
$35.00
$6.85
$35.01
$45.00
$8.85
$45.01
$55.00
$9.85
$55.01
$75.01
$11.85
$75.01
$100.00
$12.85
$100.01
$200.00
$14.85
$200.01
$300.00
$15.85
$300.01
$500.00
$17.85
$500.01
+
$18.85

Priority Mail Shipping Costs:

Order Total Minimum
Order Total Maximum
USA Priority Mail Shipping Rates
$00.01
$25.00
$10.50
$25.01
$35.00
$11.50
$35.01
$45.00
$12.50
$45.01
$55.00
$13.50
$55.01
$75.01
$14.50
$75.01
$100.00
$16.50
$100.01
$200.00
$18.50
$200.01
$300.00
$21.50
$300.01
$500.00
$24.50
$500.01
+
$25.50

Canada First Class International (see Shipping page for exclusions)

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Order Total Maximum
Canada First Class International
$00.01
$45.00
$15.95
$45.01
$90.00
$29.95
$90.01
$150.00
$49.95
$150.01
$300.00
$59.95
$300.01
$700.00
$79.95
$700.01
$2000.00
$99.95

Canada Priority Mail (see Shipping page for exclusions)

Order Total Minimum
Order Total Maximum
Canada Priority Mail
$00.01
$45.00
$29.95
$45.01
$90.00
$39.95
$90.01
$150.00
$59.95
$150.01
$300.00
$79.95
$300.01
$700.00
$99.95
$700.01
$2000.00
$109.95

International - Outside US / CA (see Shipping page for exclusions)

Order Total Minimum
Order Total Maximum
International - Outside US / CA
$100.00
$150.00
$79.95
$150.01
$300.00
$99.95
$300.01
$500.00
$139.95
$500.01
$1000.00
$169.95
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Additional Information


Solder Preform Chips
Stamping: Flux-Coated
Alloy: SN63/PB37
Core: Solid

Preforms are put between surfaces that are being soldered. The preform area is heated locally with a soldering iron, torch, hot air tool, or the entire assembly can be passed through a suitable oven. The assembly should be heated above the liquidus temperature of the solder alloy being used. Ideal temperatures and times for reflow and intermetallic formation depend on assembly, process and alloy used. This allows manufacturing soldering operations to be completed without using extra liquid fluxing agents which reduce throughput time and increase process yield by delivering precisely the right amount of flux to solder surfaces together.

Dimensions:
Length: 0.18"
Width: 0.8"
Thickness: 0.003"
Ext Flux: 290S 1.0% +/-0.3%

Manufactured by: Kester
Part Number: A2C5318034