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TO-220 SIL-PAD® Heat Sink Transistor Pads TO220 SPK4-006-00-61 Bergquist®

TO-220 SIL-PAD® Heat Sink Transistor Pads TO220 SPK4-006-00-61 Bergquist®

Manufacturer: Berquist®
Part Number: SPK4-006-00-61
Material: Kapton® MT
Color: Gray
Temperature: -60 to 180°C
Size (mm): 10.5 x 19.05 x .15

Price: $0.20
2400 available for immediate delivery
Code: HW027APT04
Weight: 0.01oz ONZ
Quantity:

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Additional Information

TO-220 SIL-PAD® Heatsink Insulator
NO Adhesive

Sil-Pad® is a thermally-conductive interface material developed for the electronics industry. This flexible silicone material is designed to conduct heat away from discrete components or circuit board assemblies into a heat sink, heat spreader, or equipment chassis.

Sil-Pad® is a composite of silicone rubber and fiberglass. The material is flame retardant and is specially formulated for use as a thermally conductive insulator.

The primary use for Sil-Pad® 400 is to electrically isolate power sources from heat sinks.

Sil-Pad® has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. Sil-Pad® actually improves its thermal resistance with age. The reinforcing fiberglass provides excellent cut-through resistance. Sil-Pad® 400 is non-toxic and resists damage from cleaning agents.

Features:
- Excellent thermal performance
- Eliminates the mess of grease
- More durable than mica
- Efficient "total applied cost" that compares favorably with other alternatives.
- Flame Retardant
- Excellent mechanical and physical characteristics

Physical Specs:
Color: Gray
Hardness (Shore A): 90
Breaking Strength ASTM D1458, KN/m: 5
Elongation , 45º to warp and fill, ASTM D412,%: 40
Tensile Strength, ASTM D412, MPa: 35

Electrical Specs:
Dielectric Breakdown Voltage , ASTM D149: 6000VAC
Dielectric Constant, ASTM D150 @ 1,000 Hz: 5.0
Reinforcement Carrier: Fiberglass
Volume Resistivity, ASTM D257, ohm-meter: 1 x 10^12
Operating Temperature: -60 to 180°C

Thermal Specs
Thermal Conductivity , ASTM D5470, W/(m-K): 0.9
Thermal Resistance Bergquist Flat Plate Test Method, ºC-in2/W: 0.4
Thermal Vacuum Weight Loss (TML), as manufactured, NASA SP-R-0022A, %: 0.28
Volatile Condensable Material (VCM), as manufactured, NASA SP-R-0022A, %: 0.07

Dimensions:
Length: 19.05mm (0.75")
Width: 10.5mm (0.41")
Thickness: 0.15mm (0.006")

Applications:
- Power supplies
- Automotive electronics
- Motor controls
- Power semiconductors

Manufactured by: Bergquist®
Part Number: SPK4-0.006-00-61 / TSP K900

Full Datasheet: Berquist® Series K-4 Sil-Pad® TO220

RoHS Compliant