TO-218 SIL-PAD® Heat Sink Transistor Pads TO218 3223-07 AC Bergquist®
Part Number: 3223-07
1360 available for immediate delivery
Additional InformationSil-Pad® is a thermally-conductive interface material developed for the electronics industry. This flexible silicone material is designed to conduct heat away from discrete components or circuit board assemblies into a heat sink, heat spreader, or equipment chassis.
Sil-Pad® 400 is a composite of silicone rubber and fiberglass. The material is flame retardant and is specially formulated for use as a thermally conductive insulator. The primary use for Sil-Pad® 400 is to electrically isolate power sources from heat sinks.
Sil-Pad® 400 has excellent mechanical and physical characteristics. Surfaces are pliable and allow complete surface contact with excellent heat dissipation. Sil-Pad® 400 actually improves its thermal resistance with age. The reinforcing fiberglass provides excellent cut-through resistance. Sil-Pad® 400 is non-toxic and resists damage from cleaning agents.
Typical Applications Include:
Sil-Pad® thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications. Sil-Pad® provides:
Excellent thermal performance
Eliminates the mess of grease
More durable than mica
Efficient "total applied cost" that compares favorably with other alternatives.
Thermal impedance: 1.13°C-in2/W (@50 psi)
Original Sil-Pad® material
Excellent mechanical and physical characteristics
Size: fit TO218 or TOP-3 transistors Color: Gray
Adhesive: One side
Reinforcement Carrier: Fiberglass
Hardness (Shore A): 85
Breaking Strength (lbs/inch): 30
Elongation (%45° to Warp and Fill): 54
Tensile Strength (psi)/MPa: 3000/20
Continuous Use Temp (°F): -76 to 356
Dielectric Breakdown Voltage: 3500,4500
Dielectric Constant (1000 Hz): 5.5
Volume Resistivity (Ohm-meter): 10
Flame Rating: V-O
Thermal Conductivity (W/m-K): 0.9
Manufactured by: Bergquist®
Part Number: 3223-07AC