Electronic Components Package Terms
Many of these package types are still in current production, however we've included some types that are obsolete.
Not all manufacturers use all these packages and not all manufacturers use the same standards. Please refer to the individual manufacturer's spec sheets to confirm compliance.
BGA: Ball Grid Array
CBGA: Ceramic Ball Grid Array
CDIP: Glass-Sealed Ceramic Dual In-Line Package
CDIP SB: Side-Braze Ceramic Dual In-Line Package
CFP: Both Formed and Unformed CFP
CPGA: Ceramic Pin Grid Array
CZIP: Ceramic Zig-Zag Package
DIMM: Dual-In-Line Memory Module
DFP: Dual Flat Package
FC/CSP: Flip Chip / Chip Scale Package
HLQFP: Thermally Enhanced Low Profile QFP
HQFP: Thermally Enhanced Quad Flat Package
HSOP: Thermally Enhanced Small-Outline Package
HSSOP: Thermally Enhanced Shrink Small-Outline Package
HTQFP: Thermally Enhanced Thin Quad Flat Pack
HTSSOP: Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP: Thermally Enhanced Very Thin Quad Flat Package
JEDEC: The JEDEC Standard for this package type.
JLCC: J-Leaded Ceramic or Metal Chip Carrier
LCCC: Leadless Ceramic Chip Carrier
LGA: Land Grid Array
LQFP: Low Profile Quad Flat Pack
LPCC: Leadless Plastic Chip Carrier
MCM: Multi-Chip Module
MQFP: Metal Quad Flat Package
OPTO: Light Sensor Package
PDIP: Plastic Dual-In-Line Package
PFM: Plastic Flange Mount Package
QFP: Quad Flat Package
SDIP: Shrink Dual-In-Line Package
SIMM: Single-In-Line Memory Module
SIP: Single-In-Line Package
SODIMM: Small Outline Dual-In-Line Memory Module
SOJ: J-Leaded Small-Outline Package
SOP: Small-Outline Package (Japan)
SSOP: Shrink Small-Outline Package
TFP: Triple Flat Pack
TO/SOT: Cylindrical Package
TQFP: Thin Quad Flat Package
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TVFLGA: Thin Very-Fine Land Grid Array
TVSOP: Very Thin Small-Outline Package
VQFP: Very Thin Quad Flat Package
VSOP: Very Small Outline Package
Terms Used to Describe Dimensions and Characteristics:
Pins: The number of pins or terminals on the package
Pitch: The distance between the centers of adjacent pins (in millimeters)
Length: The length of the device (in millimeters)
Maximum Height: The maximum height above board surface form (in millimeters)
Thickness: The maximum thickness of the package body (in millimeters)
Width: The width of the device (in millimeters)