Tag Archives: HDI PCB

How mSAP Enhances HDI PCB Capabilities

With 5G technology around the corner, we are looking at the emergence of 5G smartphones. While this requires new manufacturing technologies such as high-density interconnect Printed Circuit Boards (HDI PCB), smartphones need to be less expensive and produced at greater efficiencies. Customers usually covet compact sleek devices. Therefore, manufacturers need to balance function and form so that their products stand out in a crowd in a competitive marketplace. The smartphone market can be a treacherous Read more [...]