Tag Archives: BGA

Advanced PCB Technologies — High Density Interconnect

Engineers often face a peculiar dilemma. On one hand, they need to enhance the functionalities of electronic gadgets they design so that customers have more value for their money, while they are constrained to use a sleek form factor. Not only does this impose a tremendous challenge to cram many components within a highly restricted space, but the challenge extends to maintaining the quality and integrity of the design as well. Designers meet the challenge in different ways. They use subminiature Read more [...]

Variables in Lead-Free Reflow for PCBs

Reflow ovens often show degrees of variability from profile to profile. This may depend on the distribution of components on the board, especially those that are slow heating, heat-sensitive, or of high mass. In general, reflow systems cannot generate one single reflow profile producing capable thermal results for all products. For instance, a large BGA package on the PCB may not allow more than five degrees of variation near the peak of the reflow profile curve. Therefore, even while the BGA Read more [...]