Tag Archives: KIC Profiler

Variables in Lead-Free Reflow for PCBs

Reflow ovens often show degrees of variability from profile to profile. This may depend on the distribution of components on the board, especially those that are slow heating, heat-sensitive, or of high mass. In general, reflow systems cannot generate one single reflow profile producing capable thermal results for all products. For instance, a large BGA package on the PCB may not allow more than five degrees of variation near the peak of the reflow profile curve. Therefore, even while the BGA Read more [...]