Tag Archives: copper

What is Micro-porous Copper Foam Technology?

Apart from Aluminum, Copper is the most widely used material for making heat sinks, because properties of copper make it suitable for the purpose. Chief among them is its superior thermal conductivity and malleability. That means copper conducts heat better than most other materials and it is easy to form into different shapes that a heat sink necessitates. However, latest research has revealed another form of copper that promises still better thermal conductivities. In today's high-density electronics, Read more [...]

Graphene Metal Sandwich Improves Electronics

Heat conducting properties of the metal Copper are well known. However, scientists have been able to improve this property even further. By creating a sandwich of graphene with copper, scientists have found that the heat conducting properties of copper are strongly enhanced. Expectedly, this discovery could lead to further downscaling of electronic products. This pioneering discovery is the work of two professors – Alexander A. Balandin and Konstantin S. Novoselov. Balandin is a professor of Read more [...]