Tag Archives: Thermal Management

What is Micro-porous Copper Foam Technology?

Apart from Aluminum, Copper is the most widely used material for making heat sinks, because properties of copper make it suitable for the purpose. Chief among them is its superior thermal conductivity and malleability. That means copper conducts heat better than most other materials and it is easy to form into different shapes that a heat sink necessitates. However, latest research has revealed another form of copper that promises still better thermal conductivities. In today's high-density electronics, Read more [...]