Daily Archives: November 6, 2018

What are Ball Grid Arrays?

Initially, surface mount devices, especially ICs, came as perimeter-only packages, with pins for soldering placed along the edge of the device. As ICs became more complex, they needed more pins for external interfacing, which made the packages larger. Manufacturers soon realized there was a large unused real estate that lay just under the package. Therefore, they made the ball grid array (BGA) packaging, which, in place of pins, had solder balls aligned in a grid under the device. Soldering BGAs Read more [...]